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 (R)
BAT41
SMALL SIGNAL SCHOTTKY DIODE
DESCRIPTION General purpose metal to silicon diode featuring very low turn-on voltage and fast switching. This device has integrated protection against excessive voltage such as electrostatic discharges.
DO-35
ABSOLUTE RATINGS (limiting values)
Symbol VRRM IF IFRM IFSM Ptot Tstg Tj TL Parameter Repetitive Peak Reverse Voltage Forward Continuous Current* Repetitive Peak Forward Current* Surge non Repetitive Forward Current* Power Dissipation* Storage and Junction Temperature Range Maximum Lead Temperature for Soldering during 10s at 4mm from Case Ta = 25C tp 1s 0.5 tp 10ms Ta = 95C Value 100 100 350 750 100 - 65 to +150 - 65 to +125 230 Unit V mA mA mA mW C C C
THERMAL RESISTANCE
Symbol Rth(j-a) Junction-ambient* Test Conditions Value 300 Unit C/W
ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS
Symbol VBR VF * * IR * * Tj = 25C Tj = 25C Tj = 25C Tj = 25C Tj = 100C Test Conditions IR = 100A IF = 1mA IF = 200mA VR = 50V Min. 100 0.4 0.45 1 0.1 20 A Typ. Max. Unit V V
DYNAMIC CHARACTERISTICS
Symbol C Tj = 25C Test Conditions VR = 1V f = 1MHz Min. Typ. 2 Max. Unit pF
* On infinite heatsink with 4mm lead length * * Pulse test: tp 300s < 2%.
October 2001 - Ed: 1B
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BAT41
Fig. 1: Forward current versus forward voltage at different temperatures (typical values). Fig. 2: Forward current versus forward voltage (typical values).
Fig. 3: Reverse current versus junction temperature.
Fig. 4: Reverse current versus continuous reverse voltage (typical values).
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BAT41
Fig. 5: Capacitance C versus reverse applied voltage VR (typical values).
3/4
BAT41
PACKAGE MECHANICAL DATA DO-35 REF.
C A
C
DIMENSIONS Millimeters Min. Max.
4.50 2.00
OB /
Inches Min.
0.120 0.060 1.102
Max.
0.177 0.079
A
OD / OD /
3.05 1.53 28.00 0.458
B C D
0.558
0.018
0.022
Cooling method : by convection and conduction Marking: clear, ring at cathode end. Weight: 0.15g
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 4/4


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